PCB Assemblies

PCB Assemblies

by Conelec Team
Our factory is equipped with state-of-the-art, well-maintained equipment for producing both Surface Mount Technology (SMT) and mixed technology PCB assemblies. All of the essential support services including design for manufacturing (DFM) , material sourcing and testing are available in-house to make your program as turnkey as you need. Our proprietary traceability system, ACES, provides real-time reports such as DPMO and first pass yield for fast problem resolution.

Printed Circuit Board Assemblies Capability Summary

  • IPC-A-610 Class 2 and Class 3 workmanship
  • Repair technicians certified to IPC 7711 and IPC 7721
  • BGA rework
  • Lead and RoHS assembly
  • Package on Package (POP) Capability
  • BGA, micro-BGA and fine pitch assembly ā€“ 4000+ ball count ā€“ Minimum .4mm ball pitch ā€“ Minimum .3mm lead pitch
  • Placement speeds up to 70,000 cph
  • SMT chip placement down to 01005
  • Automated optical inspection (AOI)
  • Solder paste inspection (SPI)
  • X-Ray inspection
  • Conelecā€™s ERSA Ecoselect 2, selective solder machine adds an unrivaled ability to create reliable and repeatable solder joints while offering maximum manufacturing flexibility for your printed circuit board assembly
  • Automated acrylic conformal coating deposition
  • Potting/encapsulation

Ersa ECOSELECT 2 Selective Solder Machine

The newest addition to our factory floor, the ECOSELECT, enhances our capability to scale production programs, including new product introduction.